Abstract:
The Optical Fiber Communication Conference and Exhibition (OFC) was held in San Francisco, USA, on April 1, 2025. Doctoral student Jinwei Su from the research group attended the conference and engaged in on-site academic exchanges.
From March 30 to April 3, 2025, Jinwei Su traveled to San Francisco to participate in the 50th Optical Fiber Communication Conference (OFC), the most influential academic conference in the global optical communication field. The conference brought together thousands of experts from academia and industry to conduct in-depth discussions on cutting-edge research, industrial applications, and future trends in optical fiber communication technologies. During the event, Jinwei Su systematically reviewed the latest developments in optical communications through oral presentations, academic exchanges, poster sessions, and industrial exhibitions, exchanging perspectives with peers based on his research focus. The summary is organized into three aspects: academic achievements, academic insights, and industrial observations.
Academic Presentation: Micro-Transfer-Printed High-Speed Optical Switching Technology
In the "Switches and Control of Photonic Circuits" session on April 2, Jinwei Su delivered a 12-minute oral presentation titled *"Broadband and Low-Crosstalk 2×2 Electro-Optic Switch via Micro-Transfer Printed TFLN on Si₃N₄."* The presentation focused on the innovative application of micro-transfer printing technology in the fabrication of high-speed optical switching chips, proposing an optical switching solution based on a heterogeneously integrated lithium niobate-on-silicon nitride photonic platform. This platform achieves picosecond-scale switching speeds while maintaining compatibility with ultra-low-loss silicon nitride commercial foundry platforms. Experimental results indicate that this technology holds promise for significantly reducing energy consumption and latency in data center optical interconnects and edge computing scenarios. Following the presentation, several scholars engaged in discussions regarding technical scalability and process compatibility. Some suggested further exploration of co-optimization with co-packaged optics (CPO) architectures, while industry representatives showed interest in its feasibility for mass production. This presentation not only validated the academic value of the technical approach but also laid the groundwork for subsequent industry-academia-research collaboration.
Cutting-Edge Academic Trends: From High-Speed Modulators to IMDD
During the conference, Jinwei Su closely followed前沿research on core devices for optical communication systems. In specialized sessions on intensity modulation direct detection (IMDD) and high-speed modulators, the KIT team presented an optimized design for high-performance silicon photonic modulators, achieving data rates exceeding 500 Gbps per lane, suitable for short-reach data center applications. Furthermore, multiple presentations focused on the combination of advanced modulation formats (e.g., PAM4, QAM) with novel materials (e.g., thin-film lithium niobate, barium titanate), revealing potential future breakthroughs in modulator bandwidth, linearity, and power consumption.
Industrial Technology Trends and Product Insights
At the concurrent industry exhibition, leading global optical communication companies showcased the following technology developments:
Co-Packaged Optics (CPO): Companies including Intel and Cisco introduced multiple CPO prototype products, aiming to reduce the interconnection distance between optical engines and ASIC chips to the millimeter scale to meet the ultra-high density requirements of AI computing clusters.
Optical Switching and LiDAR: Ipronics launched a reconfigurable 32×32 optical switching matrix for multi-functional applications, while LiDAR manufacturer Innoviz demonstrated solid-state radar modules based on 1550 nm light sources, emphasizing their advantages in anti-interference capabilities for autonomous driving.
Optical Modules and Heterogeneous Integration: InnoLight introduced a 1.6T OSFP-XD pluggable optical module utilizing chip-on-carrier (CoC) technology. Intel announced its heterogeneous integration foundry service, supporting wafer-level hybrid integration of III-V materials with silicon-based devices. Ligentec disclosed lithium niobate-silicon nitride wafer bonding heterogeneous integration services, along with III-V photodetector-silicon nitride heterogeneous integration foundry services, expected to address mass production bottlenecks in photonic chips.
This participation clarified the core value of optoelectronic technologies in the "computing era." We look forward to promoting the transformation of academic achievements into industrial applications through continuous innovation.
