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    Integrated Devices System-on-Chip Packaging & Testing Functional Modules Terminal Equipment
  • Tackling Core Technical Bottlenecks: Associate Professor Yu Li from Professor Linjie Zhou's Team, in Collaboration with Professor Qunbi Zhuge's Team, Makes Breakthrough Progress in Data Center High-Speed Optical Interconnects
    2025-07-29
  • Professor Linjie Zhou's Team Breaks Through Optical Interconnect Chip Bottleneck: Near-Zero-Power Tuning! Creates Non-Volatile Intelligent Programmable Microring Array Optical Transceiver Chip
    2025-07-24
  • Professor Jianping Chen's Research Group Reports Latest Achievements on Micro-Transfer-Printed Lithium Tantalate/Silicon Nitride Heterogeneous Integrated High-Speed Modulator at CLEO 2025 PDP
    2025-05-28
  • Doctoral Student Chuxin Liu Wins the "Eoptolink Outstanding Paper Award" at the China Fiber Connection Forum
    2023-06-07
    Center of Photonic Integration and Communications
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